A unique potting and encapsulant silicone epoxy compound, Tough Seal 21 solves key issues that pose engineering challenges in the manufacture of electronic and electrical components that are designed for use in harsh and dynamic high-stress conditions. The product of years of rigorous science-based testing at Key Polymer Corporation’s research facility, Tough Seal 21 offers optimal thermal cycling characteristics that provide stability and unbreakable performance in applications, such as automotive, refrigeration and aircraft electronic connectors, where wide and rapid changes in temperature are the norm. Tough Seal 21 offers exceptional ease of use.  It sets quickly at room temperature to form a hardened encapsulating polymer with exceptional flexibility to - 40°C and elevated temperature resistance to 300°F. As a silicone epoxy, Tough-Seal picks up where other encapsulants drop off, while its tough, rubbery nature delivers thermal cycling performance not typically found in epoxy potting compound materials when encapsulating the electrical and electronic components from the environment. For more information on silicone epoxy encapsulants and other products available through the Key Polymer Corporation please call 888-KEYPOLY, or email toughseal@keypolymer.com.